OXPEKK

The ultra high-performance thermoplastic

What is it?

OXPEKK®, OPM’s proprietary poly-ether-keytone-keytone (PEKK) formulation, is an ultra high-performance thermoplastic material.

A semi-crystalline polymer, OXPEKK exhibits superb mechanical, thermal, and chemical properties, making it suitable for applications in a variety of industries, from medical to aerospace, automotive, energy and building materials.

advantages of OXPEKK

thermal stability

With a Tg of 163C and Tm of 360C, PEKK is well suited to high temperature environments

chemical resistance

PEKK is one of the most chemically resistant thermoplastics on the planet

Mechanical Performance

PEKK’s tensile strength (yield) of 136 MPa and compressive strength (207 MPa) make it an ideal alternative to metals in many applications

biological properties

PEKK has unique, bone-like mechanics and superior wear properties - all of the biological and biomechanical properties that make it the ideal replacement for bone

Co-polymer system

Unlike PEEK, we can alter the physical, chemical and thermal properties of PEKK to suit your application

Flame/radiation resistant

PEKK has a UL94 V-0 flammability rating and is near impervious to any amount of radiation

What makes OXPEKK different?

OXPEKK-LTS

OPM’s superior synthesis technology

Our unique PEKK low temperature synthesis (OXPEKK®-LTS) method results in a PEKK polymer that is superior to the traditional synthesis methods.

OXPEKK-LTS Advantages:

  • Exceptional stability and repeatability

  • Size-controlled spherical powder or flake

  • Low polydispersity

  • Non-ODCB VOC synthesis process

  • Exclusive patented technology

OXPEKK-x

The OXPEKK-LTS synthesis method enables the creation of PEKK variants through the modification of the polymer backbone in ways not possible with conventional synthesis methods. We refer to these variants collectively as OXPEKK-X.

By splicing PEKK with Imides, Sulfones, Aliphatics, Phenylenes or other functional groups, we can create PEKK derivatives that excel in new applications.